{
  "Header": {
    "GenerationSoftware": {
      "Vendor": "KiCad",
      "Application": "Pcbnew",
      "Version": "9.0.9-9.0.9~ubuntu24.04.1"
    },
    "CreationDate": "2026-05-15T23:03:34+02:00"
  },
  "GeneralSpecs": {
    "ProjectId": {
      "Name": "Flow_Controller_Panel",
      "GUID": "466c6f77-5f43-46f6-9e74-726f6c6c6572",
      "Revision": "rev?"
    },
    "Size": {
      "X": 100.1,
      "Y": 50.1
    },
    "LayerNumber": 2,
    "BoardThickness": 1.6002,
    "Finish": "None"
  },
  "DesignRules": [
    {
      "Layers": "Outer",
      "PadToPad": 0.127,
      "PadToTrack": 0.127,
      "TrackToTrack": 0.127,
      "MinLineWidth": 0.4,
      "TrackToRegion": 0.5,
      "RegionToRegion": 0.5
    }
  ],
  "FilesAttributes": [
    {
      "Path": "Flow_Controller_Panel-Edge_Cuts.gm1",
      "FileFunction": "Profile",
      "FilePolarity": "Positive"
    }
  ],
  "MaterialStackup": [
    {
      "Type": "Legend",
      "Name": "Top Silk Screen"
    },
    {
      "Type": "SolderPaste",
      "Name": "Top Solder Paste"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Top Solder Mask"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "Front"
    },
    {
      "Type": "Dielectric",
      "Thickness": 1.5102,
      "Material": "FR4",
      "Name": "Front/Back",
      "Notes": "Type: dielectric layer 1 (from Front to Back)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "Back"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Bottom Solder Mask"
    },
    {
      "Type": "SolderPaste",
      "Name": "Bottom Solder Paste"
    },
    {
      "Type": "Legend",
      "Name": "Bottom Silk Screen"
    }
  ]
}
