panelized design

scripts/output/Flow_Controller_Panel-job.gbrjob

@@ -0,0 +1,87 @@
+{
+  "Header": {
+    "GenerationSoftware": {
+      "Vendor": "KiCad",
+      "Application": "Pcbnew",
+      "Version": "9.0.9-9.0.9~ubuntu24.04.1"
+    },
+    "CreationDate": "2026-05-15T23:03:34+02:00"
+  },
+  "GeneralSpecs": {
+    "ProjectId": {
+      "Name": "Flow_Controller_Panel",
+      "GUID": "466c6f77-5f43-46f6-9e74-726f6c6c6572",
+      "Revision": "rev?"
+    },
+    "Size": {
+      "X": 100.1,
+      "Y": 50.1
+    },
+    "LayerNumber": 2,
+    "BoardThickness": 1.6002,
+    "Finish": "None"
+  },
+  "DesignRules": [
+    {
+      "Layers": "Outer",
+      "PadToPad": 0.127,
+      "PadToTrack": 0.127,
+      "TrackToTrack": 0.127,
+      "MinLineWidth": 0.4,
+      "TrackToRegion": 0.5,
+      "RegionToRegion": 0.5
+    }
+  ],
+  "FilesAttributes": [
+    {
+      "Path": "Flow_Controller_Panel-Edge_Cuts.gm1",
+      "FileFunction": "Profile",
+      "FilePolarity": "Positive"
+    }
+  ],
+  "MaterialStackup": [
+    {
+      "Type": "Legend",
+      "Name": "Top Silk Screen"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Top Solder Paste"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Top Solder Mask"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "Front"
+    },
+    {
+      "Type": "Dielectric",
+      "Thickness": 1.5102,
+      "Material": "FR4",
+      "Name": "Front/Back",
+      "Notes": "Type: dielectric layer 1 (from Front to Back)"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "Back"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Bottom Solder Mask"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Bottom Solder Paste"
+    },
+    {
+      "Type": "Legend",
+      "Name": "Bottom Silk Screen"
+    }
+  ]
+}