text formattig

Readme.md

@@ -123,13 +123,13 @@ Place the presensitized copper board on the **Anycubic Photon Mono 4** printer's
 
 ### 7. Etching
 
-For the developed Bungard photoresist PCB, etch the board using either `sodium persulfate` or `ferric chloride`.
+For the developed **Bungard** photoresist PCB, etch the board using either **sodium persulfate** or **ferric chloride**.
 
-- For `sodium persulfate`, prepare a solution with approximately 200–250 g/L and heat it to 40–50 °C.
+- For **sodium persulfate**, prepare a solution with approximately **200–250 g/L** and heat it to **40–50 °C**.
 
-- For `ferric chloride`, use a ready-to-use solution or prepare it according to the manufacturer's instructions and maintain a temperature of 35–45 °C. 
+- For **ferric chloride**, use a ready-to-use solution or prepare it according to the manufacturer's instructions and maintain a temperature of **35–45 °C**. 
 
-Immerse the board in the etchant and agitate gently until all exposed copper has been removed, typically within 5–15 minutes. Rinse the board thoroughly with water after etching. To remove the remaining photoresist, immerse the board in a 2–5% `sodium hydroxide (NaOH)` solution at room temperature for 1–2 minutes, then rinse thoroughly with water and dry the board.
+Immerse the board in the etchant and agitate gently until all exposed copper has been removed, typically within 5–15 minutes. Rinse the board thoroughly with water after etching. To remove the remaining photoresist, immerse the board in a **2–5% sodium hydroxide (NaOH)** solution at room temperature for **1–2 minutes**, then rinse thoroughly with water and dry the board.
 
 ### 8. Drilling holes and milling board outlines
 
@@ -182,14 +182,13 @@ Traces should appear black on white background.
 - background = UV exposed = resist removed = etched away
 - traces = dark = resist kept = copper stays
 
-Start with `--exposure 60` and bracket from there — **Bungard** presensitized at 405nm typically lands between 30–180s depending on board vintage and storage.
+Start with `--exposure 60` and bracket from there — **Bungard** presensitized at **405nm** typically lands between **30–180s** depending on board vintage and storage.
-
-UV light curing Solder Mask from **Mechanic** needs 15 minutes when prebaked (heat it to 80C for 15 minutes) otherwise 30 minutes. Use green as the solder mask and white for the silkscreen.
 
+**UV light curing Solder Mask** needs **15 minutes** exposure time when prebaked (heated to **80 °C** for **15 minutes**), otherwise expose for **30 minutes**. Use *green* color for the **solder mask** and *white* color for the **silkscreen**.
 
 #### 4.1. Export print files for copper layers
 
-Export the front and back **copper** layers for 120 seconds exposure
+Export the front and back **copper** layers for **120 seconds** exposure
 ```bash
 pcb-expose.sh Dummy.pm4n gerbers/Flow_Controller_Panel-Front.gtl \
     --invert --mirror --exposure 120 \
@@ -202,7 +201,7 @@ pcb-expose.sh Dummy.pm4n gerbers/Flow_Controller_Panel-Back.gbl \
 
 #### 4.2. Export print files for soldermask layers
 
-Export the front and back **soldermask** layers for 900 seconds exposure
+Export the front and back **soldermask** layers for **900 seconds** exposure
 ```bash
 pcb-expose.sh Dummy.pm4n gerbers/Flow_Controller_Panel-F_Mask.gts \
     --invert  --mirror --exposure 900 \
@@ -215,7 +214,7 @@ pcb-expose.sh Dummy.pm4n gerbers/Flow_Controller_Panel-B_Mask.gbs \
 
 #### 4.1. Export print files for silkscreen layers
 
-Export the front and back **silkscreen** layers for 900 seconds exposure
+Export the front and back **silkscreen** layers for **900 seconds** exposure
 ```bash
 pcb-expose.sh Dummy.pm4n gerbers/Flow_Controller_Panel-F_Silkscreen.gto \
     --mirror --exposure 900 \